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 Symposium on Signal Integrity

Topic Abstracts

Dr. Eric Bogatin, BeTheSignal
Data mining S-parameters: getting started
S-parameters have become the de facto standard to store information about interconnect and channel performance. Though growing in popularity, they are often treated as black boxes. This presentation will sift through the valuable information contained in S-parameters, obtained from measurement or simulation, exploring time domain, frequency domain, single-ended and differential forms, and with 1, 2, 4 and 12 ports.

Dr. Antonio Ciccomancini Scogna, Principal Engineer
Computer Simulation Technology (CST)
Efficient workflow for full-wave analysis and simulation of mixed-signal 3D package designs The presentation will cover the challenges and need for a unified EDA environment, integrated with full-wave 3D solver, that enables signal integrity, power integrity and IC/package parasitic-aware functional simulation. The designer should be able to make design changes and re-analyze without having to leave the design environment.


Mr. Mike Resso, Signal Integrity Application Scientist, Agilent
A simple way to characterize high speed interconnects
A new calibration technique for VNA measurements dramatically simplifies de-embedding fixtures and unwanted physical layer structures to extract an S-parameter behavioral model of a device of interest. Performing a measurement with a 4-port VNA of a device with SMA connectors and getting an S-parameter behavioral model of the structure is easy, but it is difficult to get a behavioral model without the artifacts of the SMAs, the launches and the fixturing to the device of interest. Techniques such as microprobes, LRM and TRL calibration processes have been developed to help mitigate some problems.

Dr. Jon Martens, Measurement System Architectures, Anaritsu
Interconnect characterization: potential accuracies of common de-embedding approaches As high-speed serial data rates increase, the characterization of interconnects becomes more important and the ability to accurately de-embed fixtures and launch structures, more critical. This talk examines the more common de-embedding techniques and how they react to launch parasitics issues (probe touch-down or connector launch inconsistencies), line impedance variations, reflection standard definitions and other items, with the goal of creating a more complete picture of how to better choose a de-embedding method based on the structure and feasible standards.


Dr. Paul G. Huray, Professor of Electrical Engineering, University of South Carolina
Ideal vs. real-world foundations of signal propagation
Industry and University partnerships are crucial for continued U.S. leadership in high performance electrical systems. Industry signal integrity design engineers often depend upon empirical studies or parameterized formulas that strive for percentage performance gains influenced by incremental costs. University studies are more often grounded on multidisciplinary principles based on Maxwell’s equations, material properties, rigorous mathematical analysis, and numerical simulations that can yield order of magnitude performance gains with little regard to implementation cost. This presentation will contrast examples of the two approaches.


Mr. John Smith, Product Specialist, Tektronix
Ultra high-speed transport systems: how to characterize using active stressors Traditional signal integrity easurements, specifically receiver tolerance (JTOL) measurements, have employed the use of Bit Error Rate Test ets, oscilloscopes (real-time or sampling) and noise sources for haracterizing/validating receiver performance in a digital communication link. The BERTScope provides an integrated and frequency agile test platform (up to 26Gb/s) for making these measurements quickly and easily. This presentation will address how the BERTScope addresses these test challenges.


Dr. Bruce Archambeault, Distinguished Engineer, IBM
Advances in EMI/EMC design
This talk will focus on real-world applications of advances in EMI/EMC design, highlighting issues concerning high speed differential signals in connectors and cables. New techniques, such as using Electromagnetic Band Gap (EBG) structures, will be discussed as will EMI/EMC limits on common mode energy conversion in high speed differential connectors and cables.


Mr. Dennis D. Poulin, Senior RF and MW Field Applications Engineer, Anritsu Company
Application of vector-network analyzers in balanced transmission-line signal integrity measurements
Topics in this presentation will include the use of baluns versus multiport VNA’s , pros and cons; the use of VNA-based time domain measurements versus the traditional TDR on balanced transmission lines; superposition-based differential measurements versus “True Differential” using a multiport VNA; and fixturing considerations in connecting to balanced structures.